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  technical data sheet lamp view led prepared date oct. 2010 rev. 1 page 1 of 8 customer: technical data sheet pn: for: if=20ma contents customer confirm approved by checked by issued by hebei i.t. (shanghai) co., lt d. www.ledz.com 3751XB7D-S 1.features 2.applications 3.package dimensions 4.absolute maximum rating 5.electrical optical characteristics 6. ranks combination 7.soldering conditions 8.typical electro-optical characteristics curves 9.reliability 10.cautions 11.notes
technical data sheet lamp view led prepared date oct. 2010 rev. 1 page 2 of 8 part no. emitted color blue face color blue diffused chip material ingan/gan viewing angle 105/55 features: compatible with automatic placement equipment compatible with reflow solder process low power consumption this product doesn?t contain restric tion substance, comply rohs standard. applications: automotive and telecommunication flat backlight for lcd ,switch and symbol in telephone and fax general use for indicators package dimensions: note 1.all dimensions in mm tolerance is 0.2mm unless otherwise noted. 2. an epoxy meniscus may extend about 1.5mm down the leads. 3.burr around bottom of epoxy may be 0.5mm max. +0.1 -0.2 anode cathode 3.2 3.9 6.10 1.50 0.5 2 .54 1.50max 1.15 hebei i.t. (shanghai) co., lt d. www.ledz.com 3751XB7D-S
technical data sheet lamp view led prepared date oct. 2010 rev. 1 page 3 of 8 absolute maximum rating ta=25 parameter symbol max. unit power dissipation p m 100 mw pulse forward current i fp 100 ma dc forward current i f 30 ma reverse voltage v r 5 v operating temperature range topr -30 85 storage temperature range tstg -40 100 * i fp condition: pulse width 0.1ms ,duty cycle 1/10 electrical optical characteristics ta=25 parameter symbol min typ. max. unit test condition luminous intensity i v 300 -- 620 mcd i f =20ma dominant wavelength d 465 -- 475 nm i f =20ma forward voltage vf 3.0 -- 3.6 v i f =20ma reverse current ir -- -- 10 ua v r =5v viewing angle 2 1/2 -- 105/55 -- deg. i f =20ma ranks combination (if = 20ma) rank wd(nm) 465-467.5 467.5-470 470-472.5 472.5-475 rank iv 300-360 360-430 430-520 520-620 rank vf(v) 3.0-3.6 notes: 1.tolerance of luminous intensity 15%. 2.tolerance of dominant wavelength 1nm. 3.tolerance of forward voltage 0.05v. 4.optical characteristic is measured by hb?s equipment. hebei i.t. (shanghai) co., lt d. www.ledz.com
technical data sheet lamp view led prepared date oct. 2010 rev. 1 page 4 of 8 soldering conditions (maximum allowable soldering conditions) lead-free solder mode fixed form hand soldering 1. soldering time : 3 sec max. 2. distance : 3 mm min ( from solder joint to case ) dip soldering 1. preheat temp : 100 c max , 60 sec max. 2. bath temp : 265 c max. 3. bath time : 3 sec max. 4. distance : 3 mm min (from solder joint to case) 5. decrease temperature externally an d compulsorily after dip soldering) hebei i.t. (shanghai) co., lt d. www.ledz.com
technical data sheet lamp view led prepared date oct. 2010 rev. 1 page 5 of 8 typical electro-optical characteristics curves 0 20 1.6 1.8 2.2 2.0 2.4 2.6 vf (v) fig.1 forward current vs. forward voltage 60 40 80 100 if (ma) 0.0 1.0 3.0 2.0 4.0 5.0 020 60 40 80 100 if (ma) fig.2 relative luminous intensity vs. forward current iv 60 40 20 0 -20 ta ( ) fig.4 relative luminous intensity vs.ambient temperature 70 50 10 30 -10 -30 2.0 1.0 0.5 0.2 0.1 iv half wide= 25nm domi wl=470nm fig.3 relative luminous intensity vs. wavelength wl(nm) iv 650 600 500 550 450 400 1.0 0.8 0.4 0.6 0.2 0.0 100 80 40 60 20 0 fig.5 maximum forward current vs.ambient temperature ta ( ) if (ma) 30 40 20 0 10 50 fig.6 relative luminous intensity vs. radiation angle 100% 50% 90 iv 0 30 60 30 60 90 0% x-x y-y x-x y-y hebei i.t. (shanghai) co., lt d. www.ledz.com
technical data sheet lamp view led prepared date oct. 2010 rev. 1 page 6 of 8 reliability (1)test items and conditions test item standard test method test conditions note number of damaged reflow soldering jeita ed-4701 300 301 tsld=260 3 sec (pre treatment 30 ,70%,168hrs) 2 time 0/100 high temperature storage jeita ed-4701 200 201 t a =100 1000 hrs 0/100 low temperature storage jeita ed-4701 200 202 t a =-40 1000 hrs 0/100 temperature humidity storage jeita ed-4701 100 103 t a =60 rh=90%rh 1000 hrs 0/100 thermal shock test jeita ed-4701 300 307 -40 ~ 100 15min 15 min 100 cycles 0/100 temperature cycling test jeita ed-4701 100 105 -40 ~25 ~100 ~25 30min 5min 30min 5min 100 cycles 0/100 operating life test t a =25 i f =20ma 1000 hrs 0/100 (2)criteria of judging the damage item symbol test conditions criteria for judgment min. max. forward voltage v f i f =20 ma --- initial data 1.1 luminous intensity i v i f =20 ma initial data 0.8 --- reverse current i r v r = 5v --- Q 2 a wave length d/ p if=test current / initial data2nm appearance / view check no mechanical damage hebei i.t. (shanghai) co., lt d. www.ledz.com
technical data sheet lamp view led prepared date oct. 2010 rev. 1 page 7 of 8 cautions 1 package when moisture is absorbed into the package it may vaporize and expand during soldering. there is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the leds. so the moisture proof package is used to keep moisture to a minimum in the package. 2 storage ?before opening the package a. avoid the absorption of moisture, we recommended to store the leds in a dry box(or desiccator) with a desiccant . otherwise, store them in the follo wing environment: temperature : 5 ~30 ,humidity : 60%max. b. the products should be used in 3 months. it is recommended that the leds be used as soon as possible. ?after opening the package a. soldering should be done right after opening the package(within 24hrs). b. keeping of a fraction -sealing -temperature : 5 ~ 30 ,humidity : less than 30% c. if the package has been opened more than 1week or the color of desiccant changes, components should be dried for 10-12hr at 605 3 lead forming ?when the lead forming is required before soldering , care must be taken to avoid any bending and mechanical stress. the stress to the base may damage the leds. ?when mounting the leds onto a pcb, the holes on the circuit board should be exactly aligned with the leads of the leds. ?it is recommended that tooling made to precisely form and cut the leads to length rather than rely on hand operating. 4 the led electrode sections are co mprised of a gold plated. the gold surface may be affected by environments which contain corrosive gases and so on. please avoid conditions which may cause the led to corrode or discolor. this corrosion or discoloration may cause difficulty during soldering operations. it is recommended that the user use the leds as soon as possible. 5 please avoid rapid transitions in ambient temperature, especially in high hum idity environments where condensation can occur. 6 static electricity 6.1 these products are sensitive to static electricity charge, and users are required to handle with care. particularly, if an current and or voltage which exceeds the absolute maximum rating of products is applied, the overflow in energy may cause damage to, or possibly result in electrical destruction of, the products. the customer is requested to take adequate countermeasur es against static electricity charge and surge when handling products. 6.2 proper grounding of products , use of conductive mat, conductive working uniform and shoes, and conductive containers are effective against static electricity and surge. hebei i.t. (shanghai) co., lt d. www.ledz.com
technical data sheet lamp view led prepared date oct. 2010 rev. 1 page 8 of 8 6.3 ground low-resistance areas where th e product contacts, such as metal surfaces of the work platform, with a conductive mat (surface resistance 10 6 -10 8 ). 6.4 a tip of soldering iron is requested to be grounded. an ionizer should also be installed where risk of static generation is high. 7 circuit protection below the zener reference voltage v z , all the current flows through led and as the voltage rises to v z , the zener diode ?breakdown?. if the voltage tries to rise above v z current flows through the zener branch to keep the voltage at exactly v z . when the led is connected using seri al circuit, if either piece of led is no light up but current can not flow through causing others to light down. in new design, the led is parallel with zener diode, if either piece of led is no light up but current can flow through causing others to light up. notes: 1 above specification may be changed without notice. we will reserve authority on material change for above specification. 2 when using this product, please observe the absolute maximum ratings and the instructions for the specification sheets. we assume no responsibility for any damage resulting from use of the product which does not comply with the instructions included in the specification sheets. hebei i.t. (shanghai) co., lt d. www.ledz.com


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